WB222 is a WiFi BLE Combo Mini PCIe Module based on QualcommR AR9462 which is a single chip with 2.4 / 5GHz dual bands 802.11 a/b/g/n and BT 4.0.
The AR9462 is a single-chip solution that combines dual-bands (2.4/5 GHz), 2-stream 802.11a/n and BT 4.0 for notebooks, netbooks and tablets. The highly integrated solution not only provides customers with greater design flexibility, but can actually improve the wireless experience for consumers.
The AR9462 brings Qualcomm XSPAN’s industry-leading 2×2 802.11n performance to increasingly smaller computing and CE devices. It delivers data rates of 300 Mbps and TCP throughput of more than 200 Mbps when used in 2×2 mode. It also offers a unique set of advanced 11n technologies known as Signal-Sustain Technology™ (SST), which ensures stronger wireless connections across the entire WLAN link. SST features include Low Density Parity Checking (LDPC), Maximum Ratio Combining (MRC) and Maximum Likelihood Demodulation (MLD) – which together can increase rate-over-range performance by up to 100% at short range, 50% at mid-range and 25% at long range.
Qualcomm offers a robust platform that streamlines the design of wireless devices. AR9462 is upstream-compatible with Android and Chrome OS. Microsoft software is available for Windows 10/8/7, Vista, and XP. The chip also offers a PCIe interface for WLAN, and Qualcomm’s DirectConnect™ technology offers Wi-Fi Direct CERTIFIED support for P2P applications. In addition, its Fast Channel Switch (FCS) feature, the channel switching time is reduced to as little as 1 ms within band and to 2ms in between the 2.4 GHz and 5 GHz bands.
AR9462 integrates several external components, including the 2.4 GHz and 5 GHz Low Noise Amplifiers and Power Amplifiers, switching regulators, and the WLAN and Bluetooth EEPROMs. This can dramatically reducte the RBOM of a standard PCIe Half Mini Card by up to 45%, relative to discrete 2×2 dual-band and Bluetooth combination solutions.
While offering superior performance and a high degree of integration, the AR9382 also consumes lower power in every operation mode – Active TX, Active RX, Idle Associated, and Sleep – compared to discrete solutions. This enables notebooks, tablets and other computing platforms to run much longer on a single battery charge.
Highly integrated single chip solution combining QualcommR XSPAN’s dual-band, 2×2 802.11n and Bluetooth 4.0
- 2-stream 802.11n offers a maximum PHY rate of 300 Mbps
- Conserves power with 1×1 downshift, using Dynamic MIMO
- Power Save and low platform power with Qualcomm CoolMode
- Supports Qualcomm’s Signal-Sustain Technology™ (SST),
- WLAN features are such as LDPC, MLD, and STBC
- Supports Qualcomm Wake on Wireless™ (WoW) Cloud and Qualcomm StreamBoost™
- Supports High Speed and Low Energy operation
- Supports Enhanced Data Rate (EDR) for both 2 Mbps (π/4-DQPSK) and 3 Mbps (8-DPSK)
Wake on Wireless LAN (WoW) and Wake on Bluetooth (WoBT)
Fast Channel Switch (1 ms within band and 2 ms across bands)
Advanced integrated coexistence features (beyond discrete chipset coexistence) to maximize combo performance
Supports antenna sharing between Bluetooth and WLAN
Two separate On Chip One Time Programmable (OTP) Memories for WLAN and Bluetooth
Integrated PA, LNA, Tx/Rx switch, Regulator
|Standards||IEEE 802.11 a/b/g/n 2.4 / 5GHz dual bands 802.11d, 802.11e, 802.11j and 802.11i|
|Wireless Signal Rates With Automatic Fallback||300Mbps(dynamic)|
|Wireless Transmit Power||18dBm(MAX)|
|Modulation Type||1M DBPSK, 2M DQPSK, 5.5M/11M CCK,
|Receiver Sensitivity||300M: [email protected]% PER
150M: [email protected]% PER
54M: [email protected]% PER
11M: [email protected]% PER
6M: [email protected]% PER
1M: [email protected]% PER
256K: [email protected]% PER
|Wireless Range||Indoors up to 100m, Outdoors up to 150m.|
|Wireless Security||64/128/152 bit WEP
WPA/WPA2, WPA-PSK/WPA2-PSK (TKIP/AES)
|Support Operating System||Windows 7, Windows 8, Windows 10, Vista, XP and Linux (including Chrome OS)|
|Interface||32-bit Mini PCI-e connector|
|Certifications||CE, FCC by requested|
|Operating Temperature||0 ℃~115 ℃ (32℉~239℉)|
|Storage Temperature||-60 ℃~150 ℃ (-76℉~302℉)|
|Relative Humidity||10% ~ 90%, non condensation|
|Storage Humidity||5%~95% non-condensing|
|Dimensions||30 x 26.8mm|